Carte de circuit imprimé de moniteur d'hôpital de HDI

No.

Items

Spec

1

Layers

1 to 24 layer

2

Max working panel area

457x610mm

3

Min board thickness

4 layer:0.40mm

6 layer:0.80mm

8 layer:1.00mm

10 layer:1.20mm

4

Min trace width

0.10mm

5

Min spacing

0.10mm

6

Min hole diameter

0.20mm

7

Min Copper thickness in hole

0.020mm

8

PHT size tolerance

±0.05mm

9

NPTH size tolerance

±0.025mm

10

Hole position tolerance

±0.05mm

11

Dimension tolerance

±0.1mm

12

Min solder mask dam

0.08mm

13

Solder Mask

Double-sided green LPI,Also support Red,White,Yellow,Blue,Black

14

Silk Screen

Double-sided or single-sided in white,yellow,black,or negative

15

Surface Finish

HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.

16

Board shape

Retangular,round,slots,cutouts,complex,irregular

17

Board type

Rigid,Rigid-flexible,HDI,BGA,FPC

18

Board material

FR4 glass epoxy,FR4 high Tg,ROHS compliant,aluminum,Rogers,FR1,CM1,CM3,etc.

19

Board cutting

Shear,V-score,Tab-routed

20

Test

Visual inspection,E-test

21

Insulation resistance

1E+12Ω (normal condition)

22

Max Board thickness/Hole size Rate

10 : 1

23

Thermal shock endurance

288 3 times in 10sec

24

Max Board twist and wrap

≤0.7%

25

High Vlotage endurance

1.3KV/mm

26

Copper foil peel off endurance

1.4N/mm

27

Hardness of resist ink

≥6H

28

Flame resistance

94V-0

29

Impedance control

±5%

30

Certificate

ISO 9001:2000;ISO 14001;ISO/TS ISO 9001:2000;ISO 14001;UL E203640